Published
IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
The contents of the corrigendum of September 2019 have been included in this copy.
WITHDRAWN
IEC 61191-2:2013 ED2
PUBLISHED
IEC 61191-2:2017 ED3
60.60
Standard published
May 23, 2017
PUBLISHED
IEC 61191-2:2017/COR1:2019 ED3
Shqip