IEC 61191-2:2013 ED2

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Publication date: Jun 5, 2013

General information

Current stage: 99.60 Effective date: May 23, 2017

Next stage: WPUB

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.190 31.240

Languages: English French

Buying

Status: Revised

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Scope

IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition:
- IPC-A-610 on workmanship has been included as a normative reference;
- some of the terminology used in the document has been updated;
- references to IEC standards have been corrected;
- the use of lead-free solder paste and plating are addressed.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 61191-2:1998 ED1

NOW

WITHDRAWN
IEC 61191-2:2013 ED2
99.60 Withdrawal effective
May 23, 2017

REVISED BY

PUBLISHED
IEC 61191-2:2017 ED3