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IEC 62951-5:2019 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

Feb 27, 2019

General information

60.60     Feb 27, 2019

IEC

TC 47

International Standard

31.080.99  

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Scope

IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.

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PUBLISHED
IEC 62951-5:2019 ED1
60.60 Standard published
Feb 27, 2019

National adoptions

SSH IEC 62951-5:2019  
DPS

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

60.60 Standard published

DPS/KT 7 more