IEC TS 62647-2:2012 ED1

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

Publication date: Nov 29, 2012

General information

Current stage: 60.60 Effective date: Nov 29, 2012

Originator: IEC

Owner: TC 107

Type: Technical Specification

ICS: 03.100.50 31.020 49.060

Languages: English

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Status: Published

PDF - ALL 41,271

Paper - ALL 41,271

CD - ALL 41,271

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Scope

IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62647-2:2011 ED1

NOW

PUBLISHED
IEC TS 62647-2:2012 ED1
60.60 Standard published
Nov 29, 2012

REVISED BY

ABANDON
IEC TS 62647-2 ED2