IEC PAS 62647-2:2011 ED1

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin

Publication date: Jun 22, 2011

General information

Current stage: 99.60 Effective date: Nov 29, 2012

Originator: IEC

Owner: TC 107

Type: Publicly Available Specification

ICS: 03.100.50 31.020 49.060

Languages: English

Buying

Status: Replaced

PDF - ALL 28,268

Paper - ALL 28,268

CD - ALL 28,268

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Scope

IEC/PAS 62647-2:2011(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of tin finishes in electronic systems. This PAS is applicable to aerospace and high performance electronic applications which procure equipment that may contain Pb-free tin finishes.

Life cycle

NOW

WITHDRAWN
IEC PAS 62647-2:2011 ED1
99.60 Withdrawal effective
Nov 29, 2012

REVISED BY

PUBLISHED
IEC TS 62647-2:2012 ED1