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IEC 62374-1:2010 ED1

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

Sep 29, 2010

General information

60.60     Sep 29, 2010

IEC

TC 47

International Standard

31.080.99  

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IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

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PUBLISHED
IEC 62374-1:2010 ED1
60.60 Standard published
Sep 29, 2010