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IEC 62258-6:2006 ED1

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

Aug 28, 2006

General information

60.60     Aug 28, 2006

IEC

TC 47

International Standard

31.080.99  

English  

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Scope

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2

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PUBLISHED
IEC 62258-6:2006 ED1
60.60 Standard published
Aug 28, 2006