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IEC 63378-6 ED1

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

General information

50.99     Aug 29, 2025

IEC

TC 47/SC 47D

International Standard

31.080.01  

Life cycle

NOW

IN_DEVELOPMENT
IEC 63378-6 ED1
50.99 FDIS or proof approved for publication
Aug 29, 2025