IEC 60749-10:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

Publication date: Apr 9, 2002

General information

Current stage: 99.60 Effective date: Apr 27, 2022

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Languages: English French Spanish

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Status: Revised

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Scope

Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages.

The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

WITHDRAWN
IEC PAS 62186:2000 ED1

NOW

WITHDRAWN
IEC 60749-10:2002 ED1
99.60 Withdrawal effective
Apr 27, 2022

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-10:2002/COR1:2003 ED1

REVISED BY

PUBLISHED
IEC 60749-10:2022 ED2