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IEC 60749-16:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Jan 17, 2003

General information

60.60     Jan 17, 2003

IEC

TC 47

International Standard

31.080.01  

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Published

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Scope

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62171:2000 ED1

NOW

PUBLISHED
IEC 60749-16:2003 ED1
60.60 Standard published
Jan 17, 2003

National adoptions

SSH IEC 60749-16:2003  
DPS

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

60.60 Standard published

DPS/KT 7 more