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SSH IEC 60749-16:2003

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Dec 5, 2011

General information

60.60     Dec 5, 2011

DPS

DPS/KT 7

International Standard

31.080.01  

English  

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Scope

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Life cycle

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PUBLISHED
SSH IEC 60749-16:2003
60.60 Standard published
Dec 5, 2011

Related project

Adopted from IEC 60749-16:2003 ED1 IDENTICAL

Adopted from IEC 60749-16 Ed. 1.0 b