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SSH EN 60749-25:2003

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Dec 18, 2006

General information

60.60     Jan 1, 2006

DPS

DPS/KT 4

European Norm

31.080.01  

English  

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Scope

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Life cycle

NOW

PUBLISHED
SSH EN 60749-25:2003
60.60 Standard published
Jan 1, 2006

Related project

Adopted from EN 60749-25:2003

Adopted from IEC 60749-25 Ed. 1.0 b