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DS IEC TR 62878-2-7:2019 ED1

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Oct 12, 2026

General information

60.60     Oct 12, 2026

DPS

DPS/KT 8

Technical Report

31.180     31.190  

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Scope

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

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DS IEC TR 62878-2-7:2019 ED1
60.60 Standard published
Oct 12, 2026

Related project

Adopted from IEC TR 62878-2-7:2019 ED1 IDENTICAL