prDS IEC TR 62878-2-7:2019 ED1

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

General information

Current stage: 40.20 Effective date: Feb 9, 2026

Next stage: 40.60 Next stage date: May 11, 2026

Originator: DPS

Owner: DPS/KT 8

Type: Technical Report

ICS: 31.180 31.190

Scope

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

Life cycle

NOW

IN_DEVELOPMENT
prDS IEC TR 62878-2-7:2019 ED1
40.20 DIS ballot initiated: 12 weeks
Feb 9, 2026

Related project

Adopted from IEC TR 62878-2-7:2019 ED1 IDENTICAL

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