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prDS IEC TR 62878-2-7:2019 ED1

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

General information

40.60     May 11, 2026

60.60   

DPS

DPS/KT 8

Technical Report

31.180     31.190  

Scope

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

Life cycle

NOW

IN_DEVELOPMENT
prDS IEC TR 62878-2-7:2019 ED1
40.60 Close of voting
May 11, 2026

Related project

Adopted from IEC TR 62878-2-7:2019 ED1 IDENTICAL