SSH EN IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Publication date: Jun 13, 2024

General information

Current stage: 60.60 Effective date: Jun 13, 2024

Next stage: 95.99

Originator: DPS

Owner: DPS/KT 8

Type: European Norm

ICS: 31.180

Languages: English

Buying

Status: Published

PDF - ALL 2,439

Paper - ALL 2,439

CD - ALL 2,439

PDF and Paper - ALL 4,878

Language

Language in which you want to receive the document.

Scope

This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.

Life cycle

NOW

PUBLISHED
SSH EN IEC 61189-2-804:2023
60.60 Standard published
Jun 13, 2024

SSH EN IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

General information

Buying

Scope

Life cycle

NOW

Related project

Adopted from EN IEC 61189-2-804:2023 IDENTICAL

Adopted from IEC 61189-2-804:2023

Adopted from EN IEC 61189-2-804:2023