SSH EN IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

Publication date: Jun 13, 2024

General information

Current stage: 60.60 Effective date: Jun 13, 2024

Next stage: 95.99

Originator: DPS

Owner: DPS/KT 8

Type: European Norm

ICS: 31.180

Languages: English

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Status: Published

PDF - ALL 2,439

Paper - ALL 2,439

CD - ALL 2,439

PDF and Paper - ALL 4,878

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Scope

This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).

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PUBLISHED
SSH EN IEC 61189-2-803:2023
60.60 Standard published
Jun 13, 2024

SSH EN IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

General information

Buying

Scope

Life cycle

NOW

Related project

Adopted from EN IEC 61189-2-803:2023 IDENTICAL

Adopted from IEC 61189-2-803:2023

Adopted from EN IEC 61189-2-803:2023