SSH EN IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

Publication date: Jun 13, 2024

General information

Current stage: 60.60 Effective date: Jun 13, 2024

Next stage: 95.99

Originator: DPS

Owner: DPS/KT 8

Type: European Norm

ICS: 31.180

Languages: English

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Status: Published

PDF - ALL 2,677

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PDF and Paper - ALL 5,354

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This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

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PUBLISHED
SSH EN IEC 61189-2-801:2023
60.60 Standard published
Jun 13, 2024

SSH EN IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

General information

Buying

Scope

Life cycle

NOW

Related project

Adopted from EN IEC 61189-2-801:2023 IDENTICAL

Adopted from EN IEC 61189-2-801:2023

Adopted from IEC 61189-2-801:2023