SSH EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

Publication date: Oct 12, 2022

General information

Current stage: 60.60 Effective date: Oct 12, 2022

Next stage: 95.99

Originator: DPS

Owner: DPS/KT 8

Type: European Norm

ICS: 31.180

Languages: English

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Status: Published

PDF - ALL 2,439

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IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

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PUBLISHED
SSH EN IEC 61189-2-807:2021
60.60 Standard published
Oct 12, 2022

SSH EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA

General information

Buying

Scope

Life cycle

NOW

Related project

Adopted from EN IEC 61189-2-807:2021

Adopted from IEC 61189-2-807:2021