Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
IEC 62951-7:2019 specifies evaluation conditions and gives a method of measurement as well as a test set-up for the measurement of barrier performance for thin-film layer with ultra‑low permeation rate under both flat and bending conditions. This document also includes the preparation of specimen, electrical contacts, sensor films and calculation procedures. For these purposes, this document provides terms, definitions, symbols, configurations, and test methods including test conditions such as temperature, relative humidity, testing time.
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PUBLISHED SSH IEC 62951-7:2019 ED1 60.60
Standard published Jun 23, 2022
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