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DS IEC TR 62453-51-20:2017 ED1

Field device tool (FDT) interface specification - Part 51-20: Communication implementation for common object model - IEC 61784 CPF 2

Jul 12, 2022

General information

60.60     Jul 12, 2022

95.99   

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DPS/KT 9

Technical Report

25.040.40     35.100.05     35.110     35.11  

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IEC TR 62453-51‑20:2017(E) provides information for integrating the CIP™ technology into the COM-based implementation of FDT interface specification (IEC TR 62453-41). The Communication Profile Family 2 (commonly known as CIP™ defines communication profiles based on IEC 61158‑2 Type 2, IEC 61158‑3‑2, IEC 61158‑4‑2, IEC 61158‑5‑2, and IEC 61158‑6‑2, IEC 62026‑3. The basic profiles CP 2/1 (ControlNet™, CP 2/2 (EtherNet/IP™, and CP 2/3 (DeviceNet™1) are defined in IEC 61784‑1 and IEC 61784‑2. An additional communication profile (CompoNet™),also based on CIP™, is defined in [15]. This document specifies implementation of communication and other services based on IEC 62453‑302.

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PUBLISHED
DS IEC TR 62453-51-20:2017 ED1
60.60 Standard published
Jul 12, 2022

Related project

Adopted from IEC TR 62453-51-20:2017 ED1