DS IEC/TR 60286-7:2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

Publication date: Apr 21, 2020

General information

Current stage: 60.60 Effective date: Feb 12, 2020

Originator: DPS

Owner: DPS/KT 7

Type: Pure national standard

ICS: 31.240 31.020

Languages: English

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Status: Published

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Scope

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

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PUBLISHED
DS IEC/TR 60286-7:2019
60.60 Standard published
Feb 12, 2020

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