Published
IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.
PUBLISHED
DS IEC/TR 60286-7:2019
60.60
Standard published
Feb 12, 2020