SSH EN IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Publication date: May 29, 2020

General information

Current stage: 60.60 Effective date: Feb 5, 2020

Originator: DPS

Owner: DPS/KT 4

Type: European Norm

ICS: 31.180

Languages: English

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Status: Published

PDF - ALL 4,641

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PDF and Paper - ALL 9,282

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IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.

The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

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PUBLISHED
SSH EN IEC 61188-6-4:2019
60.60 Standard published
Feb 5, 2020

SSH EN IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

General information

Buying

Scope

Life cycle

NOW

Related project

Adopted from EN IEC 61188-6-4:2019