SSH IEC 63011-1:2018

Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology

Publication date: Apr 11, 2019

General information

Current stage: 60.60 Effective date: Jan 29, 2019

Originator: DPS

Owner: DPS/KT 7

Type: Pure national standard

ICS: 31.200

Languages: English

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Status: Published

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IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

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PUBLISHED
SSH IEC 63011-1:2018
60.60 Standard published
Jan 29, 2019

SSH IEC 63011-1:2018

Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology

General information

Buying

Scope

Life cycle

NOW

Related project

Adopted from IEC 63011-1:2018 ED1 IDENTICAL