IEC 60749-5:2017(E) provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) correction of an error in an equation;
b) inclusion of notes for guidance;
c) clarification of the applicability of test conditions.
WITHDRAWN
SSH EN 60749-5:2003
PUBLISHED
SSH EN 60749-5:2017
60.60
Standard published
Feb 9, 2018
IN_DEVELOPMENT
prSSH EN IEC 60749-5:2024