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SSH EN 62047-18:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

May 13, 2014

General information

60.60     Feb 3, 2014

DPS

DPS/KT 7

European Norm

31.080.99  

English  

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Scope

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

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PUBLISHED
SSH EN 62047-18:2013
60.60 Standard published
Feb 3, 2014

Related project

Adopted from EN 62047-18:2013