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SSH EN 60191-6-22:2013

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

May 13, 2014

General information

60.60     May 13, 2014

DPS

DPS/KT 7

European Norm

31.080.01  

English  

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Scope

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

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NOW

PUBLISHED
SSH EN 60191-6-22:2013
60.60 Standard published
May 13, 2014

Related project

Adopted from EN 60191-6-22:2013

Adopted from IEC 60191-6-22 Ed. 1.0 b