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SSH EN 62137-1-4:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

Sep 29, 2009

General information

60.60     Jan 1, 2009

DPS

DPS/KT 8

European Norm

31.190  

English  

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Scope

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

Life cycle

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PUBLISHED
SSH EN 62137-1-4:2009
60.60 Standard published
Jan 1, 2009

Related project

Adopted from EN 62137-1-4:2009

Adopted from IEC 62137-1-4 Ed. 1.0 b