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DS CLC/TR 62258-8:2008

Semiconductor die products - Part 8: EXPRESS model schema for data exchange

Nov 25, 2008

General information

60.60     Jan 1, 2008

DPS

DPS/KT 7

Technical Report

31.080.99  

English  

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Scope

IEC/TR 62258-8:2008(E), which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.

Life cycle

NOW

PUBLISHED
DS CLC/TR 62258-8:2008
60.60 Standard published
Jan 1, 2008

Related project

Adopted from CLC/TR 62258-8:2008

Adopted from IEC/TR 62258-8 Ed. 1.0 en

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