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SSH EN 62258-6:2006

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

Jul 16, 2008

General information

60.60     Jan 1, 2008

DPS

DPS/KT 7

European Norm

31.080.99  

English  

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Scope

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2

Life cycle

PREVIOUSLY

WITHDRAWN
SSH ES 59008-4-3:1999

NOW

PUBLISHED
SSH EN 62258-6:2006
60.60 Standard published
Jan 1, 2008

Related project

Adopted from EN 62258-6:2006

Adopted from IEC 62258-6 Ed. 1.0 en