SSH EN 60749-22:2003

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Publication date: Dec 18, 2006

General information

Current stage: 60.60 Effective date: Jan 1, 2006

Originator: DPS

Owner: DPS/KT 4

Type: European Norm

ICS: 31.080.01

Languages: English

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Status: Published

PDF - ALL 3,391

Paper - ALL 3,391

CD - ALL 3,391

PDF and Paper - ALL 6,782

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Scope

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

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PUBLISHED
SSH EN 60749-22:2003
60.60 Standard published
Jan 1, 2006

SSH EN 60749-22:2003

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

General information

Buying

Scope

Life cycle

NOW

Related project

Adopted from EN 60749-22:2003

Adopted from IEC 60749-22 Ed. 1.0 b