Use the form below to find the searched projects. Enter your criteria for searching (single or in combination) in the fields below and press the button “Search”.
Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
60.60 Standard published
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)
60.60 Standard published
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)
60.60 Standard published
Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)
60.60 Standard published
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
60.60 Standard published
Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
60.60 Standard published
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
60.60 Standard published
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
60.60 Standard published
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
60.60 Standard published
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
60.60 Standard published