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Organic light emitting diode (OLED) light sources for general lighting - Safety - Part 2-1: Particular requirements - Semi-integrated OLED modules
10.00 Proposal for new project registered
Organic light emitting diode (OLED) light sources for general lighting - Safety - Part 2-2: Particular requirements - Integrated OLED modules
10.00 Proposal for new project registered
Organic light emitting diode (OLED) light sources for general lighting - Safety - Part 2-3: Particular requirements - Flexible OLED tiles and panels
10.00 Proposal for new project registered
Residual current operated circuit-breakers for household and similar use - Part 1: Outline of blocks and modules for residual current device standards
40.20 DIS ballot initiated: 12 weeks
Amendment 1 - Residual current operated circuit-breakers for household and similar use - Part 1: Outline of blocks and modules for residual current device standards
40.20 DIS ballot initiated: 12 weeks
Residual current operated circuit-breakers for household and similar use - Part 3-1: Particular requirements for devices with screwless-type terminals for external copper conductors
40.20 DIS ballot initiated: 12 weeks
Residual current operated circuit-breakers for household and similar use - Part 3-2: Particular requirements for devices with flat quick-connect terminations
40.20 DIS ballot initiated: 12 weeks
Residual current operated circuit-breakers for household and similar use - Part 3-3: Specific requirements for devices with screw-type terminals for external untreated aluminium conductors and with aluminium screw-type terminals for use with copper or with aluminium conductors
40.20 DIS ballot initiated: 12 weeks
Device embedded substrate - Part 2-2: Guidelines - Electrical testing
40.20 DIS ballot initiated: 12 weeks
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
40.20 DIS ballot initiated: 12 weeks
Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
40.20 DIS ballot initiated: 12 weeks
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
40.20 DIS ballot initiated: 12 weeks
Device embedded substrate - Part 2-1: Guidelines - General description of technology
40.20 DIS ballot initiated: 12 weeks
Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
40.20 DIS ballot initiated: 12 weeks
Device embedded substrate - Part 2-3: Guidelines - Design guide
40.20 DIS ballot initiated: 12 weeks
Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
40.20 DIS ballot initiated: 12 weeks
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
40.20 DIS ballot initiated: 12 weeks
Surface cleaning appliances - Part 1: General requirements on test material and test equipment
40.20 DIS ballot initiated: 12 weeks
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