20.00 Oct 10, 2025
ISO
ISO/TC 206
International Standard
This document defines a method for evaluating effective in-plane thermal conductivity and conductance of a metalized ceramic substrate bearing a heater chip as an imitation of a SiC power semiconductor. The method provides an indicator for in-plane heat transfer properties of metalized ceramic substrates employed in high-power modules.
IN_DEVELOPMENT
ISO/AWI 4825-4
20.00
New project registered in TC/SC work programme
Oct 10, 2025