Published
ISO/TS 10303-1716:2018-11 specifies the application module for
Layered interconnect complex template.
The following are within the scope of
ISO/TS 10303-1716:2018-11:
footprint definition;
footprint definition shape;
padstack definition;
padstack definition shape;
items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;
items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.
WITHDRAWN
ISO/TS 10303-1716:2014
PUBLISHED
ISO/TS 10303-1716:2018
90.60
Close of review
Dec 3, 2025