60.60 Dec 18, 2018
ISO/TC 184/SC 4
ISO/TS 10303-1685:2018-11 specifies the application module for
Interconnect module to assembly module relationship.
The following are within the scope of
assembly requirement for interconnect substrate;
assembly component based symbol placement in substrate requirement;
assembly component based annotation text placement in substrate requirement;
assembly component feature to layout feature requirement relationship;
external references for assembly component;
external references for assembly component feature;
60.60 Standard published
Dec 18, 2018
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