Published
ISO/TS 10303-1685:2018-11 specifies the application module for
Interconnect module to assembly module relationship.
The following are within the scope of
ISO/TS 10303-1685:2018-11:
assembly requirement for interconnect substrate;assembly component based symbol placement in substrate requirement;assembly component based annotation text placement in substrate requirement;assembly component feature to layout feature requirement relationship;external references for assembly component;external references for assembly component feature;
WITHDRAWN
ISO/TS 10303-1685:2014
PUBLISHED
ISO/TS 10303-1685:2018
90.20
Standard under periodical review
Jul 15, 2025
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