Published
ISO/TS 10303-1682:2018-11 specifies the application module for
Interconnect 2D shape.
The following are within the scope of
ISO/TS 10303-1682:2018-11:
embedded physical component location;
continuous planar feature shape definition.
Revises
ISO/TS 10303-1682:2014
PUBLISHED
ISO/TS 10303-1682:2018
60.60
Standard published
Dec 18, 2018
Only informative sections of projects are publicly available. To view the full content, you will need to members of the committee. If you are a member, please log in to your account by clicking on the "Log in" button.