Published
ISO/TS 10303-1650:2018-11 specifies the application module for
Bare die.
The following is within the scope of
ISO/TS 10303-1650:2018-11:
The
representation of the information needed to describe a semiconductor material product
that is an integrated circuit component, or that may be a discrete active component,
or that may be included as a component in an electronic assembly.
Terminal information is supported, including explicit shape data.
A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called
a package.
definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural
simulation model, and shape.
Revises
ISO/TS 10303-1650:2014
PUBLISHED
ISO/TS 10303-1650:2018
60.60
Standard published
Dec 18, 2018
Only informative sections of projects are publicly available. To view the full content, you will need to members of the committee. If you are a member, please log in to your account by clicking on the "Log in" button.
Shqip