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ISO 9455-5:2014

Soft soldering fluxes — Test methods — Part 5: Copper mirror test

Jun 19, 2014
95.99 Withdrawal of Standard   Oct 2, 2020

General information

95.99     Oct 2, 2020

ISO

ISO/TC 44/SC 12

International Standard

25.160.50  

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Scope

ISO 9455-5:2014 specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.

Life cycle

PREVIOUSLY

WITHDRAWN
ISO 9455-5:1992

NOW

WITHDRAWN
ISO 9455-5:2014
95.99 Withdrawal of Standard
Oct 2, 2020

REVISED BY

PUBLISHED
ISO 9455-5:2020