Withdrawn
ISO/TS 10303-1689:2010-07 specifies the application module for
Interconnect physical requirement allocation.
The following are within the scope of
ISO/TS 10303-1689:2010-07:
thermal isolation requirement definition;electrical isolation requirement definition;thermal isolation template for substrate design;electrical isolation template for substrate design;length tolerance on spacing requirement;allocation of an isolation requirement to a shield realized as part of an interconnect substrate.
WITHDRAWN
ISO/TS 10303-1689:2010
WITHDRAWN
ISO/TS 10303-1689:2010
95.99
Withdrawal of Standard
Nov 18, 2014
WITHDRAWN
ISO/TS 10303-1689:2014