IEC 61249-8-8:1997 ED1

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

Publication date: Jun 24, 1997

General information

Current stage: 60.60 Effective date: Jun 24, 1997

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Languages: English French Spanish

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Status: Published

PDF - ALL 4,523

Paper - ALL 4,523

CD - ALL 4,523

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Scope

Provides requirements for the qualification of temporary solder resist coatings.

Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.

Life cycle

NOW

PUBLISHED
IEC 61249-8-8:1997 ED1
60.60 Standard published
Jun 24, 1997