IEC 60691:1993 ED2

Thermal-links - Requirements and application guide

Publication date: Mar 30, 2001

General information

Current stage: 99.60 Effective date: Dec 19, 2002

Originator: IEC

Owner: TC 32/SC 32C

Type: International Standard

ICS: 29.120.50

Languages: English French

Buying

Status: Revised

PDF - ALL 40,140

Paper - ALL 40,140

CD - ALL 40,140

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Scope

Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circum- stances in the immediate surroundings of such thermal-links are comparable with those in this standard.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60691:1980 ED1

NOW

WITHDRAWN
IEC 60691:1993 ED2
99.60 Withdrawal effective
Dec 19, 2002

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60691:1993/AMD1:1995 ED2

WITHDRAWN
IEC 60691:1993/AMD2:2000 ED2

REVISED BY

WITHDRAWN
IEC 60691:2002 ED3