IEC PAS 62647-23:2011 ED1

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

Publication date: Jul 28, 2011

General information

Current stage: 99.60 Effective date: Oct 7, 2013

Originator: IEC

Owner: TC 107

Type: Publicly Available Specification

ICS: 03.100.50 31.020 49.060

Languages: English

Buying

Status: Replaced

PDF - ALL 31,660

Paper - ALL 31,660

CD - ALL 31,660

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Scope

IEC/PAS 62647-23:2011(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes.

Life cycle

NOW

WITHDRAWN
IEC PAS 62647-23:2011 ED1
99.60 Withdrawal effective
Oct 7, 2013

REVISED BY

PUBLISHED
IEC TS 62647-23:2013 ED1