IEC PAS 62647-1:2011 ED1

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management

Publication date: Jun 22, 2011

General information

Current stage: 99.60 Effective date: Aug 9, 2012

Originator: IEC

Owner: TC 107

Type: Publicly Available Specification

ICS: 03.100.50 31.020 49.060

Languages: English

Buying

Status: Replaced

PDF - ALL 13,003

Paper - ALL 13,003

CD - ALL 13,003

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Scope

IEC/PAS 62647-1:2011(E) defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that aerospace and high performance electronic systems containing Pb-free solder, piece parts, and boards will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. The goal is to communicate requirements for a Lead-free Control Plan (LFCP) and to assist suppliers in the development of their own plans.

Life cycle

NOW

WITHDRAWN
IEC PAS 62647-1:2011 ED1
99.60 Withdrawal effective
Aug 9, 2012

REVISED BY

PUBLISHED
IEC TS 62647-1:2012 ED1