IEC PAS 62137-3:2008 ED1

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

Publication date: Nov 13, 2008

General information

Current stage: 99.60 Effective date: Nov 8, 2011

Originator: IEC

Owner: TC 91

Type: Publicly Available Specification

ICS: 31.190

Languages: English

Buying

Status: Replaced

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Scope

IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.

Life cycle

NOW

WITHDRAWN
IEC PAS 62137-3:2008 ED1
99.60 Withdrawal effective
Nov 8, 2011

REVISED BY

PUBLISHED
IEC 62137-3:2011 ED1