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IEC TR 62453-502:2009 ED1

Field device tool (FDT) interface specification - Part 502: Communication implementation for common object model - IEC 61784 CPF 2

Aug 18, 2009

General information

99.60     Jun 15, 2017

IEC

TC 65/SC 65E

Technical Report

25.040.40     35.100.05     35.11  

English  

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Scope

IEC/TR 62453-502:2009(E) is a technical report and provides information for integrating the CIP technology into the COM based implementation of FDT interface specification (IEC/TR 62453-5). Communication Profile Family 2 (commonly known as CIPTM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, and IEC 61158-6-2, IEC 62026-3. The basic profiles CP 2/1 (ControlNetTM2), CP 2/2 (EtherNet/IPTM3), and CP 2/3 (DeviceNetTM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNetTM), also based on CIPTM, is defined in [13]. It neither contains the FDT specification nor modifies it.

Life cycle

NOW


IEC TR 62453-502:2009 ED1
99.60 Withdrawal effective
Jun 15, 2017

REVISED BY

PUBLISHED
IEC TR 62453-51-20:2017 ED1

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