IEC TR 60068-3-12:2007 ED1

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

Publication date: Mar 12, 2007

General information

Current stage: 99.60 Effective date: Oct 17, 2014

Originator: IEC

Owner: TC 91

Type: Technical Report

ICS: 19.040

Languages: English

Buying

Status: Revised

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Scope

Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)

Life cycle

NOW

WITHDRAWN
IEC TR 60068-3-12:2007 ED1
99.60 Withdrawal effective
Oct 17, 2014

REVISED BY

WITHDRAWN
IEC TR 60068-3-12:2014 ED2