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IEC 60191-6-17:2011 ED1

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Jan 27, 2011

General information

60.60     Jan 27, 2011

IEC

TC 47/SC 47D

International Standard

31.080.01  

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Scope

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

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PUBLISHED
IEC 60191-6-17:2011 ED1
60.60 Standard published
Jan 27, 2011