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IEC 62137-1-3:2008 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Nov 27, 2008

General information

60.60     Nov 27, 2008

IEC

TC 91

International Standard

31.190  

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Scope

The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

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PUBLISHED
IEC 62137-1-3:2008 ED1
60.60 Standard published
Nov 27, 2008