IEC 60191-6-13:2007 ED1

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

Publication date: Jun 27, 2007

General information

Current stage: 99.60 Effective date: Sep 27, 2016

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Languages: English French

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Status: Revised

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Scope

IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.

Life cycle

NOW

WITHDRAWN
IEC 60191-6-13:2007 ED1
99.60 Withdrawal effective
Sep 27, 2016

REVISED BY

PUBLISHED
IEC 60191-6-13:2016 ED2