Thermal standardization on semiconductor packages - Part 2-3: 3D thermal simulation models of semiconductor packages for steady-state analysis - LQFP packages
General information
10.60Jun 26, 2026
IEC
TC 47/SC 47D
International Standard
Life cycle
NOW
IN_DEVELOPMENT PNW 47D-1008 ED1 10.60
Close of voting Jun 26, 2026