Materials for printed boards and other interconnecting structures - Part 2-XX: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate
General information
10.60Nov 7, 2025
IEC
TC 91
International Standard
Life cycle
NOW
IN_DEVELOPMENT PNW 91-2063 ED1 10.60
Close of voting Nov 7, 2025