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IEC 61249-2-56 ED1

Materials for printed boards and other interconnecting structures - Part 2-56: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate

General information

20.99     Jun 5, 2026

CD    Jun 30, 2026

IEC

TC 91

International Standard

31.180  

Life cycle

NOW

IN_DEVELOPMENT
IEC 61249-2-56 ED1
20.99 WD approved for registration as CD
Jun 5, 2026